Green silicon carbide wire sawing VS. Diamond wire sawing
Green silicon carbide powder is a common wire-sawing material in the photovoltaic industry. In recent years, the photovoltaic industry has significantly shrunk, and wire sawing is mainly used for slicing silicon wafers in the semiconductor industry. Diamond wire made from SiC powder combined with steel wire and diamond powder has become the two main tools for chip sawing. The differences between the two wire sawing methods are: