APPLICATION
Amorphous boron powder for electronic pastes
High-purity amorphous boron powder acts as active p-type dopant source in electronic pastes. Its amorphous structure lowers activation energy for boron diffusion to form low-resistance ohmic contact at relatively low annealing temperature. It serves as sintering aid to densify coating and improve substrate adhesion. It forms boride phase after heat treatment for metal diffusion barrier and plasma etching resistance. It tunes coating resistivity and refines grain microstructure to improve thermal stability and reliability of electronic components.
