The advantage of Hexagonal boron nitride powder as a thermal conductive coating material
Hexagonal boron nitride (h‑BN) powder acts as high‑performance functional filler for thermal conductive coatings. It delivers high in‑plane thermal conductivity to improve heat dissipation capacity of coating layers, while retaining excellent electrical insulation, so the coated surface will not cause short‑circuit risk for electronic devices.
It has superior high‑temperature oxidation resistance. The coating filled with h‑BN keeps stable under long‑term high‑temperature service up to 900 °C in air, without obvious performance degradation. Its layered platelet structure brings good lubricity, lowering coating surface friction coefficient and enhancing scratch‑resistant property of the coating film.
h‑BN features outstanding chemical inertness. It resists acid, alkali and most solvent erosion, improves the corrosion resistance and weather resistance of finished coatings. Unlike carbon‑series thermal conductive fillers, its white tone supports light‑colored coating formulation, avoiding dark‑color limitation. In addition, h‑BN shows low dielectric loss, making it fit for thermal‑conductive coatings used in high‑frequency electronic scenarios.
