With the decline of the solar polycrystalline and monocrystalline silicon wafer wire cutting market, the domestic green silicon carbide powder cutting market is extremely shrinking. But in the field of semiconductor wire cutting, especially the inner circle cutting of single-crystal silicon, because the liquid cutting of silicon carbide cutting line can protect the smoothness of

silicon nitride ceramics： Performance: Inorganic material that does not shrink during sintering, has a small thermal expansion coefficient, and is extremely resistant to high temperatures, and its strength can be maintained to a high temperature of 1200C without falling, excellent thermal shock stability, and amazing chemical corrosion resistance, and can withstand almost all inorganic materials