Green Silicon Carbide Grain is brittle and has a high hardness (Mohs hardness 9.5). Green SiC is suitable as the raw material of grinding wheels for processing hard and brittle materials. For example, resin bond stone grinding wheel; fiber wheel, wire drawing wheel, flexible grinding wheel, nylon grinding wheel, and so on used for polishing

Green silicon carbide powder is a material with a hardness second only to diamond and boron carbide. The green SiC powder is suitable for grinding and polishing hard and brittle materials. At the same time, because the price of silicon carbide is much lower than that of diamond. Green carbon powder can be used as

With the decline of the solar polycrystalline and monocrystalline silicon wafer wire cutting market, the domestic green silicon carbide powder cutting market is extremely shrinking. But in the field of semiconductor wire cutting, especially the inner circle cutting of single-crystal silicon, because the liquid cutting of silicon carbide cutting line can protect the smoothness of

silicon nitride ceramics： Performance: Inorganic material that does not shrink during sintering, has a small thermal expansion coefficient, and is extremely resistant to high temperatures, and its strength can be maintained to a high temperature of 1200C without falling, excellent thermal shock stability, and amazing chemical corrosion resistance, and can withstand almost all inorganic materials