Product introduction of Black silicon carbide 180 mesh buffing powder
Black silicon carbide 180 mesh buffing powder is an ordinary grinding media for tough hard materials such as ceramic, crystal, marble, glass, etc. Black silicon carbide 180 mesh gets a particle size of about 50-75um. The purity of SiC is higher than 98% and hardness is above Mohs 9.2. Haixu black silicon carbide is made from quartz sand and petroleum coke instead of anthracite. So it is a durable buffing powder with high grinding efficiency.
Typical physical properties of Black silicon carbide 180 mesh buffing powder
| Hardness: | Mohs:9.2 |
| Melting Point: | dissociated at about 2300 °C |
| Maximum service temperature: | 1900℃ |
| Specific Gravity: | 3.2-3.45 g/cm3 |
| Bulk density(LPD): | 1.2-1.6 g/cm3 |
| Color: | Black |
| Particle shape: | Hexagonal |
| Modulus of Elasticity | 58-65×106 psi |
| Coefficient of Thermal Expansion | 3.9-4.5 x10-6/ ℃ |
| Thermal Conductivity | 71-130 W/MK |
Typical chemical composition of Black silicon carbide 180 mesh buffing powder
| SiC | 98.77% |
| Fe2O3 | 0.18% |
| F.C | 0.14% |
| Magnetic content | 0.011% |
Particle size distribution of black silicon carbide 180 mesh
| Particle | Mesh | Mesh Size(um) | Percentage(%) |
| Coarsest particle | +120 | 125 | 0 |
| Coarse particle | +170 | 90 | 6.92 |
| Basic particle | +200 +230 | 75 63 | 50.47 |
| Mixed particle | +200 +230 +270 | 75 63 53 | 87.28 |
| Fine particle | / | / | / |
Product Feature of Black silicon carbide 180 mesh buffing powder
- Good oxidation resistance and chemical stability at high temperatures.
- High hardness with Mohs 9.2-9.3. Even at 2000℃, it still gets high strength.
- Excellent toughness.
- Low thermal conductivity. So it can resistant to thermal shock.
- High purity min SiC content is 98.5%.
- High bulk density.
- Black silicon carbide grit is washed with water before the milling process, so there are few impurities.
Application of Black silicon carbide powder:
Abrasive sandblasting for stone, marble, granite, etc.
Surface cleaning of semiconductor aluminum alloy,etc.
Sandblasting and grinding of ceramic products and electronic ceramics.
Polishing ceramic electronic component.
Gem polishing, gem perforation.
Blasting and grinding of glass artwork, etc.
Other available Grit Sizes:
| Macro Grit Size | Average particle size（mm） | Basic particle size（mm） |
| 8# | 2.460 | 2.000-2.360 |
| 10# | 2.085 | 1.700-2.000 |
| 12# | 1.765 | 1.400-1.700 |
| 14# | 1.470 | 1.180-1.400 |
| 16# | 1.230 | 1.100-1.180 |
| 20# | 1.040 | 0.850-1.000 |
| 22# | 0.885 | 0.710-0.850 |
| 24# | 0.745 | 0.600-0.710 |
| 30# | 0.625 | 0.500-0.600 |
| 36# | 0.525 | 0.425-0.500 |
| 40# | 0.438 | 0.355-0.425 |
| 46# | 0.370 | 0.300-0.355 |
| 54# | 0.310 | 0.250-0.300 |
| 60# | 0.260 | 0.212-0.250 |
| 70# | 0.218 | 0.180-0.212 |
| 80# | 0.185 | 0.150-0.180 |
| 90# | 0.154 | 0.125-0.150 |
| 100# | 0.129 | 0.106-0.125 |
| 120# | 0.109 | 0.090-0.106 |
| 150# | 0.082 | 0.063-0.075 |
| 180# | 0.069 | 0.053-0.075 |
| 220# | 0.058 | 0.045-0.063 |
| Grit designation | Mean grain size ds50-value in μm |
| F 230 | 53.0 ± 3 |
| F 240 | 44.5 ± 2 |
| F 280 | 36.5 ± 1.5 |
| F 320 | 29.2 ± 1.5 |
| F 360 | 22.8 ± 1.5 |
| F 400 | 17.3 ± 1 |
| F 500 | 12.8 ± 1 |
| F 600 | 9.3 ± 1 |
| F 800 | 6.5 ± 1 |
| F 1000 | 4.5 ± 0.8 |
| F 1200 | 3.0 ± 0.5 |
| F 1500 | 2.0 ± 0.4 |
| F 2000 | 1.2 ± 0.3 |
| F 3000 | 0.8±0.2 |
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