In the field of sapphire wafer polishing, the commonly used grinding material is boron carbide. However, the price of boron carbide is high, and for situations that require rapid removal, GC powder (Green silicon carbide powder) can also achieve the desired grinding effect.
Usually, a layer of hard alloy material is coated on the valve body and floating ball by plasma thermal spraying technology to improve its wear resistance. It is necessary to make surface treatment on the floating ball to ensure its surface smoothness and flatness. Green SiC powder 25-28um is hard and sharp enough for grinding hard alloy coated floating ball of ball valve.
Silicon carbide black grit for grinding There are many types of abrasive grains including corundum and silicon carbide. And the principles of choose proper one are directly related to the physical and mechanical properties of the processed material. Generally speaking, when grinding workpiece materials with high tensile strength, it is advisable to choose aluminum
Nano SiC powder is an excellent additives for Electroplating solution. Particle size of 150-200nm with of α-SiC and β-SiC are both works.
GC whetstone is suitable for grinding high hardness metal materials such as martensitic stainless steel and bearing steel. As the main abrasive material in whetstone, GC 4000# powder (Green carborundum powder 4000#) has to meet the requirements as below:
Black silicon carbide is an man-made material with high hardness, strength, and refractorieness. No.14 SiC grain particle size range is 1-1.7mm, according to FEPA abrasive standard F14 grit.
