Green Silicon Carbide powder for Photoelectric wafer polishing
Green silicon carbide powder 2500#, 3000#, 4000#, and 6000# are the main grinding media for photoelectric wafer grinding. In the semiconductor industry, green silicon carbide powder 2000 to 2500 meshes was once used as the mainstream material for wire cutting of silicon wafers. With the development of wire-cutting technology and the mass production of synthetic diamond powder, diamond powder gradually replaces green silicon carbide powder. However, in the photoelectric industry, green silicon carbide powder still plays an important role in the grinding field.