Green silicon carbide powder 2500#, 3000#, 4000#, and 6000# are the main grinding media for photoelectric wafer grinding. In the semiconductor industry, green silicon carbide powder 2000 to 2500 meshes was once used as the mainstream material for wire cutting of silicon wafers. With the development of wire-cutting technology and the mass production of synthetic diamond powder, diamond powder gradually replaces green silicon carbide powder. However, in the photoelectric industry, green silicon carbide powder still plays an important role in the grinding field.

The particle size of green carborundum 1200 # micro powder is 13-15 microns. It can grind the silicon carbide sealing ring to achieve an ideal finish surface.

How to get a smooth, glossy rock as a Jewelry pendant? Children like to explore the process with their own hands. The Rock tumbler toy is very popular in recent years.

Kids can see the process of rock polishing just at home. The Rock tumbler grit always goes with black silicon carbide grit. Black silicon carbide features a high hardness than most rocks. It can even polish jade.