With the decline of the solar polycrystalline and monocrystalline silicon wafer wire cutting market, the domestic green silicon carbide powder cutting market is extremely shrinking. But in the field of semiconductor wire cutting, especially the inner circle cutting of single-crystal silicon, because the liquid cutting of silicon carbide cutting line can protect the smoothness of the wafer surface to be cut better than the solid cutting of diamond cutting line, so green silicon carbide powderhttp://greensiliconcarbide.com Always have a place in the semiconductor industry. Since semiconductor wire-cut silicon carbide powder has many different requirements for material performance from traditional abrasives, higher requirements are also put forward in terms of quality.
- Green silicon carbide particle size standard
Since the domestic production of silicon carbide powder for semiconductor wire cutting started late, domestic semiconductor manufacturers initially imported products from well-known manufacturers in developed countries, such as ESK in Germany and FUJIMI in Japan. Therefore, some domestic silicon carbide powder manufacturers mostly adopt European standards (FEPA), Japanese standards (JlS) and American standards (ANSI).
However, since most of the domestic semiconductor wire-cut silicon carbide powder is exported to Japan, the Japanese standard is widely adopted in the country. The biggest difference between domestic and foreign standards is that the particle size index adopted abroad has increased D0 (maximum particle size), while the domestic standard does not. At this stage, the domestic standard still mainly stays in the standard of ordinary abrasives and abrasives.
The semiconductor industry requires the particle size distribution of green silicon carbide powder to be concentrated as much as possible to meet the accuracy requirements of wire cutting.
- The chemical composition of green silicon carbide
The chemical composition has an impact on the crystalline form and use effect of silicon carbide powder. The higher the chemical composition, the better the overall performance.
- The particle shape of green silicon carbide
As a wire-cut micro powder for semiconductors, the particle shape will have a significant impact on the sample processing effect. Generally speaking, different from the grinding mechanism used in the grinding process, the silicon carbide powder used for semiconductor wire cutting is required to have a certain roundness value, and the particles should have sharp edges and corners.
- Bulk density of green silicon carbide
Bulk density is another important indicator of silicon carbide powder. When the particle size of the carborundum micro-powder is in the micron level, its surface area, surface energy and surface binding energy increase rapidly. The main factors affecting the bulk density of the micro powder are the specific surface area, surface energy, surface binding energy and the interaction force between particles.
- Cleanliness of green silicon carbide
Since the chip has a high requirement on the cleanliness of the surface, if the surface of the chip is contaminated by impurities, the product may be scrapped. When cutting or polishing the chip, it is easy to bring in impurities, so the surface cleanliness of the semiconductor wire cutting powder is relatively high. Green silicon carbide powder will produce a part of carbon during the smelting process. In the later screening process, although the raw silicon carbide is pickled, after further grinding, there is still a part of free carbon in the silicon carbide block. The production process of green silicon carbide powder is to pickling after grinding, avoiding the residual free carbon in the tissue, and the purity is higher (it can reach more than 99% SiC)
- Acid and alkali residue content of green silicon carbide powder
The general production process of micronized powder is the pickling process. In the whole process, if the water washing is not thorough enough, acid residues and impurities will be left on the surface of the micropowder particles. These residues may not be obvious in the micropowder stage, but if it is made into a product, it will show performance differences, which will affect the product. quality.