GC grit 320#-4000# for precut board
The main materials of precut board are resin binder and GC abrasive micro grit. The GC grit range from 320 mesh to 4000 mesh. By adjusting the particle size of the green silicon carbide abrasive, get different fineness of precut board. This product has high requirements for the main material GC abrasive powder. Especially the particle size should be as uniform, consistent, and delicate as possible.
Dicing blade is a cutting tool for semiconductor silicon chips, compound GaAs, GaP chips, oxide LiTaO3 chips, semiconductor packaging components, and semiconductor ceramic components. Dicing blade is usually made of a binder, diamond abrasive, and auxiliary materials, and its surface has cutting grooves for chip removal. Unprecut blades are prone to blade breakage during the cutting process. That causes cutting burrs and affecting cutting quality. The function of the precut board is to precutting the blade before dicing wafers. As a result, it improves the flatness of the cutting edge, making the blade sharper. In the meantime, it reduces the cutting load and easier to cut.
Obviously, the green silicon carbide obtained by overflow precipitation after acid washing and water washing get narrow particle size range. In addition, GC abrasive made from high-quality petroleum coke, long smelting time, and large smelting furnaces have more complete crystallization of silicon carbide crystals, higher purity, and higher hardness and grinding capability.
