GC 1500# GC 2000# powder for wafer sawing
GC 1500# GC 2000# powder for wafer sawing is a sawing abrasive for photovoltaic and semiconductor industries. Green silicon carbide micro powder is used for wafer sawing of silicon ingots, and its grinding mechanism is the rolling grinding of crystals by abrasive particles. Therefore, the surface of the wafer after green silicon carbide cutting is smoother, balancing cutting efficiency without too much damage to the crystal surface.
Characteristics of GC 1500# GC 2000# powder for wafer sawing：
- The material has high hardness, with a Mohs hardness of 9.4-9.5, slightly lower than that of synthetic diamond abrasives.
- Produced through the water washing overflow precipitation process, the purity of silicon carbide is greater than 98.5%, with few impurities and low iron residue and free carbon content.
- The particle shape is moderate, without particularly prominent sharp corners, and also has a certain grinding edge.
- Good consistency in particle size and uniform particle size distribution.
Typical physical properties of Green silicon carbide GC powder for Sawing:
| Mohs Hardness: | 9.4-9.5 |
| Vickers Hardness: | 3100-3400kg/mm2 |
| Knoop hardness | 2600kgf/mm2 |
| Specific Gravity: | 3.2g/cm3 |
| Particle shape: | Angular micron particle |
| Circularity | 0.87-0.92 |
| PH value | 6.8-7.1 |
| Bulk density(LPD): | 1.2-1.6 g/cm3 |
| Color: | Green |
| Melting Point: | Dissociated at about 2600 centigrade |
| Maximum service temperature: | 1900 centigrade |
| Friability | Friable |
| Thermal conductivity | 0.013 cal/cm2.sec (900°C) |
| Thermal expansion coefficient | 7-9 x10-6 /℃(0-1600°C) |
Chemical analysis of Green silicon carbide GC powder for Sawing:
| Chemical Content | Standard Value | Typical Value |
| SiC | ≥98.5% | 98.66% |
| SiO2 | ≤0.20% | 0.13% |
| F,Si | ≤0.20% | 0.11% |
| Fe2O3 | ≤0.20% | 0.09% |
| F.C | ≤0.20% | 0.18% |
Specification of Green silicon carbide GC powder for Sawing:
| JIS Grit Size | D0(Micron) | D3(Micron) | D50(Micron) | D94(Micron) |
| GC #800 | ≤ 38 | ≤ 31 | 14.0±1.0 | ≥ 9.0 |
| GC #1000 | ≤ 32 | ≤ 27 | 11.5.±1.0 | ≥ 7.0 |
| GC #1200 | ≤ 27 | ≤ 23 | 9.5±0.8 | ≥ 5.5 |
| GC #1500 | ≤ 23 | ≤ 20 | 8.0±0.6 | ≥ 4.5 |
| GC #2000 | ≤ 19 | ≤ 17 | 6.7±0.6 | ≥ 4.0 |
Application of Green silicon carbide GC powder for Sawing
- Wire cutting of solar silicon wafers.
- Wire cutting and grinding of semiconductor silicon wafers.
Production details of Green carborundum powder
Packing of Green carborundum powder
FAQ:
Q: What is the difference between green silicon carbide and black silicon carbide?
A: First of all, Green silicon carbide has higher purity of SiC(99%), black silicon carbide SiC purity is min 98%. Secondly, green silicon carbide is harder than black silicon carbide.
Q: What is the difference between FEPA,JIS standard of green silicon carbide powder?
A: Green silicon carbide powder FEPA standard is of Europen standard, it’s a coulter method based standard. Green silicon carbide powder JIS R 6001-2:2017 standard is of Japanese standard, it‘s a sedimentation method based standard.
Q: Is the green silicon carbide powder from you by air flow sieving or water sieving?
A: Our green silicon carbide powder is made by water sieving process. So the particles are of high consistency.
Q: What are the HS code and CAS NO. of silicon carbide?
A: HS code is 2849200000. CAS NO. is 409-21-2.
Q: Is there any restriction to export green silicon carbide powder from China?
A: Yes, it has to get an export license to export. We will provide it to custom.
Q: How many kgs of free samples can we get?
A: We provide free samples less than 1 kgs. Clients have to bear the express cost and DGM certificate cost.
Q: How do you inspection products before delivery?
A: We will check items of chemical, density, particle size distribution and packing before delivery. After delivery, we keep samples of each batch for 3 months.
Q: Do you demand MOQ?
A: MOQ is 1 bag, always goes 25kgs. The transportation cost will be higher than that of 1MT.
Latest News
Reviews
There are no reviews yet.