99.9% SiC powder 6-7um green for wafer cutting
During the wafer cutting process, 99.9% SiC powder 6-7um has multiple advantages compared to normal 98% SiC powder.
There are several advantages using high purity SiC microns:
1. Cutting efficiency: 99.9% SiC powder has higher hardness and grinding performance. That provide better cutting efficiency and reducing cutting time during the cutting process.
2. Surface quality: Higher purity green silicon carbide can effectively reduce defects generated during the cutting process. Thereby improves the surface quality of the wafer and reducing the difficulty of subsequent processing.
3. Wear resistance: 99.9% Silicon carbide powder has better wear resistance and can maintain good performance during long-term cutting. It can reduce the frequency of material replacement.
4. Reduce secondary pollution: Reducing impurity content means that there is less risk of contamination to the wafer during the cutting process, especially in the high demand electronics and semiconductor fields, which is crucial.
5. Thermal stability: High purity SiC powder maintains stable performance at high temperatures. That is particularly important for cutting certain special materials.
6. Stability of cutting force: 99.9% green SiC powder produces more uniform cutting force during cutting. It helps to improve cutting consistency and reduce the risk of workpiece deformation.
In summary, the advantages of 99.9% SiC powder in wafer cutting mainly lie in improving cutting efficiency, surface quality, enhancing wear resistance, reducing pollution, enhancing thermal stability, and improving the smoothness of cutting force. These advantages make it more competitive in high-end manufacturing.
