When considering grinding hard materials, green silicon carbide must be on the list of alternative materials. Aluminum nitride ceramic is a new type of ceramic with high thermal conductivity, heat shock resistance, mechanical strength, and bending strength. Its hardness can reach 12Gpa, and the Mohs hardness is 7-8. Green silicon carbide is typically suitable for grinding materials such as jade, crystal, borosilicate glass, silicon wafers, optical glass, etc., with a Mohs hardness of 6.5-7. It shows that using green SiC 5micron for polishing aluminum nitride ceramic substrates and ceramic components can also achieve efficient grinding.

In the field of sapphire wafer polishing, the commonly used grinding material is boron carbide. However, the price of boron carbide is high, and for situations that require rapid removal, GC powder (Green silicon carbide powder) can also achieve the desired grinding effect.

Silicon carbide black grit for grinding   There are many types of abrasive grains including corundum and silicon carbide. And the principles of choose proper one are directly related to the physical and mechanical properties of the processed material. Generally speaking, when grinding workpiece materials with high tensile strength, it is advisable to choose aluminum

Nano SiC powder is an excellent additives for Electroplating solution. Particle size of 150-200nm with of α-SiC and β-SiC are both works.

GC whetstone is suitable for grinding high hardness metal materials such as martensitic stainless steel and bearing steel. As the main abrasive material in whetstone, GC 4000# powder (Green carborundum powder 4000#) has to meet the requirements as below: